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| datasheet product structure silicon monolithic integrated circuit this pr oduct has no designed protec tion against radioactive rays 1/36 www.rohm.com tsz0220 1-09190g100030-1-2 27.feb.2013 rev.002 ? 2013 r ohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 serial eeprom series s tandard eeprom microw ire bus eeprom (3-wire) br93g56-3b gener al description br93g5 6-3b is serial eeprom of se rial 3-line interface method. they are 16bit organization and cs pin is the third pin in thei r pin configuration. features 3-li ne communications of chip select, serial clock, serial data input / output (the case where input and output are shared) operations available at high speed 3mhz clock (4.5v to 5.5v) high speed write available (write time 5ms max same package and pin configuration from 1kbit to 16kbit 1.7v to 5.5v single power source operation address auto increment f unction at read operation write error prevention function ? write prohibition at power on ? write prohibition by command code ? write error prevention function at low voltage self-timed programming cycle program condition display by ready / busy compact package sop8 sop-j8 ssop-b8 tssop-b8 msop8 tssop-b8j dip-t8 vson008x2030 more than 40 years data retention more than 1 million write cycles initial delivery state all addresses ffffh (x16) packag es w(typ) x d(typ)x h(max) br93g56-3b capacity bit format type power source voltage di p-t8 (1) sop8 sop-j8 ssop-b8 tssop-b8 tssop-b8j msop8 vson008 x2030 2kbit 12816 br93g56-3b 1.7v to 5.5v (1) dip-t8 i s not halogen free package sop8 5.00mm x 6.20mm x 1.71mm sop- j8 4.90mm x 6.00mm x 1.65mm v son008x 2030 2.00mm x 3.00mm x 0.60mm tssop-b8 3.00mm x 6.40mm x 1.20mm dip-t8 9.30mm x 6.50mm x 7.10mm tssop-b8j 3.00mm x 4.90mm x 1.10mm msop8 2.90mm x 4.00mm x 0.90mm ssop-b8 3.00mm x 6.40mm x 1.35mm downloaded from: http:///
2/36 datasheet datasheet br93g56-3b www.rohm.com tsz02201-09190g100030-1-2 27.feb.2013 rev.002 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 absolute maximum ratings parameter symbol rating unit remark supply voltage vcc -0.3 to +6.5 v permissible dissipation pd 800 (dip-t8) mw derate by 8.0mw/c when operating above ta=25c 450 (sop8) derate by 4.5mw/c when operating above ta=25c 450 (sop-j8) derate by 4.5mw/c when operating above ta=25c 300 (ssop-b8) derate by 3.0mw/c when operating above ta=25c 330 (tssop-b8) derate by 3.3mw/c when operating above ta=25c 310 (tssop-b8j) derate by 3.1mw/c when operating above ta=25c 310 (msop8) derate by 3.1mw/c when operating above ta=25c 300 (vson008x2030) derate by 3.0mw/c when operating above ta=25c storage temperature ts t g 65 to +150 operating temperature topr 40 to +85 input voltage/ output voltage \ -0.3 to vcc+1.0 v the max value of input voltage/out put voltage is not over 6.5v. when the pulse width is 50ns or less, the min value of input voltage/output voltage is not under -0.8v. junction temperature tjmax 150 junction temperature at the storage condition memory cell characteristics (vcc=1.7v to 5.5v) parameter limit unit conditions min typ max write cycles (1) 1,000,000 - - times ta=25 data retention (1) 40 - - years ta=25 initial data in all addresses are ffffh(x16) upon delivery. (1) not 100% tested recommended operating ratings parameter symbol limit unit supply voltage v cc 1.7 to 5.5 v input voltage v in 0 to v cc downloaded from: http:/// 3/36 datasheet datasheet br93g56-3b www.rohm.com tsz02201-09190g100030-1-2 27.feb.2013 rev.002 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 dc characteristics (unless otherwise specified, vcc=1.7v to 5.5v, ta=-40 to +85 ) parameter symbol limit unit conditions min typ max input low voltage v il -0.3 (1) - 0.3vcc v 1.7v vcc 5.5v input high voltage v ih 0.7vcc - vcc+1.0 v 1.7v vcc 5.5v output low voltage 1 v ol1 0 - 0.4 v i ol =2.1ma, 2.7v vcc 5.5v output low voltage 2 v ol2 0 - 0.2 v i ol =100 a output high voltage 1 v oh1 2.4 - vcc v i oh =-0.4ma, 2.7v vcc 5.5v output high voltage 2 v oh2 vcc-0.2 - vcc v i oh =-100 a input leakage current1 i li1 -1 - +1 a v in =0v to vcc(cs,sk,di) output leakage current i lo -1 - +1 a v out =0v to vcc, cs=0v supply current i cc1 - - 1.0 ma vcc=1.7v, f sk =1mhz, t e/w =5ms (write) - - 2.0 ma vcc=5.5v ,f sk =3mhz, t e/w =5ms (write) i cc2 - - 0.5 ma f sk =1mhz (read) - - 1.0 ma f sk =3mhz (read) i cc3 - - 2.0 ma vcc=2.5v, f sk =1mhz t e/w =5ms (wral, eral) - - 3.0 ma vcc=5.5v ,f sk =3mhz t e/w =5ms (wral, eral) standby current i sb1 - - 2.0 a cs=0v (1) when the pulse width is 50ns or less, the min value of v il is admissible to -0.8v. downloaded from: http:/// 4/36 datasheet datasheet br93g56-3b www.rohm.com tsz02201-09190g100030-1-2 27.feb.2013 rev.002 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 ac characteristics (unless otherwise specified, vcc=1.7v to 2.5v, ta=-40 to +85 ) parameter symbol limit unit min typ max sk frequency f sk - - 1 mhz sk high time t skh 250 - - ns sk low time t skl 250 - - ns cs low time t cs 250 - - ns cs setup time t css 200 - - ns di setup time t dis 100 - - ns cs hold time t csh 0 - - ns di hold time t dih 100 - - ns data 1 output delay t pd1 - - 400 ns data 0 output delay t pd0 - - 400 ns time from cs to output establishment t sv - - 400 ns time from cs to high-z t df - - 200 ns write cycle time t e/w - - 5 ms (unless otherwise specified, vcc=2.5v to 4.5v, ta=-40 to +85 ) parameter symbol limit unit min typ max sk frequency f sk - - 2 mhz sk high time t skh 230 - - ns sk low time t skl 200 - - ns cs low time t cs 200 - - ns cs setup time t css 50 - - ns di setup time t dis 100 - - ns cs hold time t csh 0 - - ns di hold time t dih 100 - - ns data 1 output delay t pd1 - - 200 ns data 0 output delay t pd0 - - 200 ns time from cs to output establishment t sv - - 150 ns time from cs to high-z t df - - 100 ns write cycle time t e/w - - 5 ms (unless otherwise specified, vcc=4.5v to 5.5v, ta=-40 to +85 ) parameter symbol limit unit min typ max sk frequency f sk - - 3 mhz sk high time t skh 100 - - ns sk low time t skl 100 - - ns cs low time t cs 200 - - ns cs setup time t css 50 - - ns di setup time t dis 50 - - ns cs hold time t csh 0 - - ns di hold time t dih 50 - - ns data 1 output delay t pd1 - - 200 ns data 0 output delay t pd0 - - 200 ns time from cs to output establishment t sv - - 150 ns time from cs to high-z t df - - 100 ns write cycle time t e/w - - 5 ms downloaded from: http:/// 5/36 datasheet datasheet br93g56-3b www.rohm.com tsz02201-09190g100030-1-2 27.feb.2013 rev.002 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 serial input / output timing 1. data is taken by di sync with the rise of sk. 2. at read operation, data is output from do in sync with the rise of sk. 3. the status signal at write (ready / busy) is output after t cs from the fall of cs after write command input, at the area do where cs is high, and valid until the next command start bit is input. and, while cs is low, do becomes high-z. 4. after completion of each mode execution, set cs low onc e for internal circuit reset, and execute the following operation mode. 5. 1/f sk is the sk clock cycle, even if f sk is maximum, the sk clock cycle cant be t skh (min)+t skl (min) 6. for write cycle time t e/w , please see figure 36,37,39,40. 7. for cs low time t cs , please see figure 36,37,39,40. block diagram figure 1.serial input/ output timing cs sk do(read) di do(write) t css t skh t skl t csh t dis t d ih t pd1 t pd0 t df status valid t sv 1/ f sk figure 2. block diagram command decode control clock generation power source voltage detection write prohibition high voltage occurrence command re g iste r address buffer sk di dummy bit do data register r/w amplifier 7bit 7bit 16bit 16bit 2,048 bit eeprom cs address decoder downloaded from: http:/// 6/36 datasheet datasheet br93g56-3b www.rohm.com tsz02201-09190g100030-1-2 27.feb.2013 rev.002 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 pin configuration top view pin description figure 3. pin configuration pin name i / o description du - dont use terminal (1) vcc - supply voltage cs input chip select input sk input serial clock input di input start bit, ope code, address, and serial data input do output serial data output, ready / busy DDDDD status display output gnd - all input / output reference voltage, 0v nc - non connected terminal (1) (1) terminals not used may be set to any of high, low, and open nc gnd do di du vcc cs sk br93g56-3b :dip-t8 br93g56f-3b :sop8 br93g56fj-3b :sop-j8 br93g56fv-3b :ssop-b8 br93g56fvt-3b :tssop-b8 br93g56fvj-3b :tssop-b8j br93g56fvm-3b :msop8 BR93G56NUX-3B :vson008x2030 downloaded from: http:/// 7/36 datasheet datasheet br93g56-3b www.rohm.com tsz02201-09190g100030-1-2 27.feb.2013 rev.002 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 typical performance curves figure 4. input high voltage vs supply voltage (cs,sk,di) figure 5. input low voltage vs supply voltage (cs,sk,di) figure 6. output low voltage1 vs output low current (vcc=2.7v) figure 7. output low voltage2 vs output low current (vcc=1.7v) 0 1 2 3 4 5 6 0123456 su ppl y vol tage: vcc(v) input high voltage : v ih (v) s ta=- ta= 2 ta= 8 0 1 2 3 4 5 6 0123456 supply voltage: vcc(v) input low voltage : v il (v) s ta=- ta= 2 ta= 8 0 0.2 0.4 0.6 0.8 1 012345 output low current:i ol (ma) output low voltage1 : v ol1 (v) s ta=- ta= 2 ta= 8 0 0.2 0.4 0.6 0.8 1 012345 output low current : i ol (ma) output low voltage2 : v ol2 (v) s ta=- ta= 2 ta= 8 downloaded from: http:/// 8/36 datasheet datasheet br93g56-3b www.rohm.com tsz02201-09190g100030-1-2 27.feb.2013 rev.002 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 typical performance curves \ continued figure 8. output high voltage1 vs output high current (vcc=2.7v) figure 9. output high voltage2 vs output high current (vcc=1.7v) 0 0.2 0.4 0.6 0.8 1 1.2 0123456 supply voltage: vcc(v) input leakage current1 : i li1 (ua) s ta=- ta= 2 ta= 8 figure 10. input leakage current1 (cs) vs supply voltage figure 11. input leakage current1 (sk) vs supply voltage 0 1 2 3 4 5 00 . 40 . 81 . 21 . 6 output high current: i oh (ma) output high voltage1 : v oh1 (v) s ta=- ta= 2 ta= 8 0 1 2 3 4 0 0.4 0.8 1.2 1.6 output high current: i oh (ma) output high voltage2 : v oh2 (v) s ta=- ta= 2 ta= 8 0 0.2 0.4 0.6 0.8 1 1.2 0123456 supply voltage: vcc(v) input leakage current1 : i li1 (ua) s ta=- ta= 2 ta= 8 downloaded from: http:/// 9/36 datasheet datasheet br93g56-3b www.rohm.com tsz02201-09190g100030-1-2 27.feb.2013 rev.002 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 typical performance curves \ continued figure 12. input leakage current1 (di) vs supply voltage figure 13. output leakage current (do) vs supply voltage figure 14. supply current (write) vs supply voltage (f sk =1mhz) figure 15. supply current (write) vs supply voltage (f sk =3mhz) 0 0.2 0.4 0.6 0.8 1 1.2 0123456 su ppl y vol tage: vcc(v) output leakage current : i lo (ua) s ta=- ta= 2 ta= 8 0 0.5 1 1.5 2 2.5 0123456 su ppl y vol tage: vcc(v) supply current (write) : i cc1 (ma) s ta=- ta= 2 ta= 8 0 1 2 3 4 5 0123456 su ppl y vol tage: vcc(v) supply current (write) : i cc1 (ma) s ta=- ta= 2 ta= 8 0 0.2 0.4 0.6 0.8 1 1.2 0123456 supply voltage: vcc(v) input leakage current1 : i li1 (ua) s ta=- ta= 2 ta= 8 downloaded from: http:/// 10/36 datasheet datasheet br93g56-3b www.rohm.com tsz02201-09190g100030-1-2 27.feb.2013 rev.002 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 typical performance curves \ continued figure 16. supply current (read) vs supply voltage (f sk =1mhz). figure 17. supply current (read) vs supply voltage (f sk =3mhz) figure 18. supply current (wral) vs supply voltage (f sk =1mhz) figure 19. supply current (wral) vs supply voltage (f sk =3mhz) 0 0.5 1 1.5 2 2.5 0123456 supply voltage: vcc(v) supply current (read): i cc2 (ma) s ta=- ta= 2 ta= 8 0 0.5 1 1.5 2 2.5 0123456 su ppl y vol tage: vcc(v) supply current (read) : i cc2 (ma) s ta=- ta= 2 ta= 8 0 0.5 1 1.5 2 2.5 0123456 su ppl y vol tage: vcc(v) supply current (wral) : i cc3 (ma) s ta=- ta= 2 ta= 8 0 1 2 3 4 5 0123456 su ppl y vol tage: vcc(v) supply current (wral): i cc3 (ma) s ta=- ta= 2 ta= 8 downloaded from: http:/// 11/36 datasheet datasheet br93g56-3b www.rohm.com tsz02201-09190g100030-1-2 27.feb.2013 rev.002 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 typical performance curves \ continued figure 20. standby current vs supply voltage (cs=0v) figure 21. sk frequency vs supply voltage figure 22. sk high time vs supply voltage figure 23. sk low time vs supply voltage 0.01 0.1 1 10 100 1000 0123456 supply voltage: vcc(v) sk frequency : f sk (mhz) s ta=- ta= 2 ta= 8 s s 0 0.5 1 1.5 2 2.5 0123456 su ppl y vol tage: vcc(v) standby current : i sb1 (ua) s ta=- ta= 2 ta= 8 0 100 200 300 400 500 0123456 su ppl y vol tage: vcc(v) sk high time : t skh (ns) s ta=- ta= 2 ta= 8 s s sk high time : t skh ( ns ) 0 100 200 300 400 500 0123456 su ppl y vol tage: vcc(v) sk low time : t skl (ns) s ta=- ta= 2 ta= 8 s s sk low time : t skl (ns) downloaded from: http:/// 12/36 datasheet datasheet br93g56-3b www.rohm.com tsz02201-09190g100030-1-2 27.feb.2013 rev.002 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 typical performance curves \ continued -300 -250 -200 -150 -100 -50 0 50 0123456 supply voltage: vcc(v) cs hold time : t csh (ns) s ta=- ta= 2 ta= 8 0 100 200 300 400 500 0123456 supply voltage: vcc(v) cs low time : t cs (ns) s ta=- ta= 2 ta= 8 s 0 50 100 150 200 250 300 0123456 supply voltage: vcc(v) cs setup time : t css (ns) s ta=- ta= 2 ta= 8 s -50 0 50 100 150 0123456 su ppl y vol tage: vcc(v) di setup time : t dis (ns) s ta=- ta= 2 ta= 8 s figure 24. cs low time vs supply voltage figure 25. cs hold time vs supply voltage figure 26. cs setup time vs supply voltage figure 27. di setup time vs supply voltage downloaded from: http:/// 13/36 datasheet datasheet br93g56-3b www.rohm.com tsz02201-09190g100030-1-2 27.feb.2013 rev.002 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 typical performance curves \ continued -50 0 50 100 150 0123456 supply voltage: vcc(v) di hold time : t dih (ns) s ta=- ta= 2 ta= 8 s 0 200 400 600 800 1000 0123456 su ppl y vol tage: vcc(v) data "0" output delay : t pd0 (ns) s ta=- ta= 2 ta= 8 s 0 100 200 300 400 500 0123456 su ppl y vol tage: vcc(v) time from cs to output establishment : t sv (ns) s ta=- ta= 2 ta= 8 s figure 28. di hold time vs supply voltage figure 29. data "0" output delay vs supply voltage figure 30. data "1" output delay vs supply voltage fi gure 31. time from cs to output establishment vs supply voltage 0 200 400 600 800 1000 0123456 su ppl y vol tage: vcc(v) data "1" output delay : t pd1 (ns) s ta=- ta= 2 ta= 8 s downloaded from: http:/// 14/36 datasheet datasheet br93g56-3b www.rohm.com tsz02201-09190g100030-1-2 27.feb.2013 rev.002 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 typical performance curves \ continued 0 50 100 150 200 250 0123456 su ppl y vol tage: vcc(v) time from cs to high-z : t df (ns) s ta=- ta= 2 ta= 8 s 0 1 2 3 4 5 6 0123456 su ppl y vol tage: vcc(v) write cycle time : t e/w (ms) s ta=- ta= 2 ta= 8 figure 32. time from cs to high-z vs supply voltage figure 33. write cycle time vs supply voltage downloaded from: http:/// 15/36 datasheet datasheet br93g56-3b www.rohm.com tsz02201-09190g100030-1-2 27.feb.2013 rev.002 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 description of operations communications of the microwire bus are carried out by sk (seria l clock), di (serial data input), do (serial data output), and cs (chip select) for device selection. when connecting one eeprom to a microcontroller, connect it as shown in figure 34(a) or figure 34(b). and when using the input and output common i/o port of th e microcontroller, connect di and do of eeprom via a resistor as shown in figure 34(b) (refer to pages 21, 22 . ), wherein connection by 3 lines is possible. in the case of connecting multiple eeprom devices, refer to figure 34 (c). communications on microwire bus is started by the first 1 input after the rise of cs. this input is called the start bit. after the start bit, the ope code, address and data are the inputted sequentially. address and data are all inputted with msb first. 0 inputs from the rise of cs to the start bit input are all ignored. therefore, when there is limitation in the bit width of pio of the microcontroller, input 0 before the start bit input, to control the bit width. command mode command start bit ope code address data msb of data(dx) is d15 required clocks(n) br93g56-3 msb of address(am) is a7 read (read) (1) 1 10 a7,a6,a5,a4,a3,a2,a1,a0 d15 to d0(read data) br93g56-3:n=27 write enable (wen) 1 00 1 1 * * * * * * br93g56-3:n=11 write disable (wds) 1 00 0 0 * * * * * * write (write) (2) 1 01 a7,a6,a5,a4,a3,a2,a1,a0 d15 to d0(write data) br93g56-3:n=27 write all (wral) (2) 1 00 0 1 * * * * * * d15 to d0(write data) erase (erase) 1 11 a7,a6,a5,a4,a3,a2,a1,a0 br93g56-3:n=11 erase all (eral) 1 00 1 0 * * * * * * ? input the address and the data in msb first manners. ? as for *, input either 1 or 0 . *start bit acceptance of all the commands of this ic starts at recognition of the start bit. the start bit means the first 1 input after the rise of cs. (1) as for read, by continuous sk clock input after setting the read command, data output of the set address starts, and addre ss data in significant order are sequentially output continuously. (auto increment function) (2) for write or write all commands, an internal erase or er ase all is included and no separate erase or erase all is needed b efore write or write all command. (a). connection by 4 lines cs sk do di cs sk di/o cs sk di do (b). connection by 3 lines cs sk di do cs3cs2 cs1 sk do di cs sk di do device 1 cs sk di do device 2 cs sk di do device 3 (c). connection example of multiple devices figure 34. connection method with microcontroller micro- controller br93gxx micro- controller micro- controller br93gxx a7 of br93g56-3 becomes don't care. downloaded from: http:/// 16/36 datasheet datasheet br93g56-3b www.rohm.com tsz02201-09190g100030-1-2 27.feb.2013 rev.002 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 timing chart 1. read cycle (read) (1) start bit after the rising edge of cs, the first data 1 input will be recognized as the start bit and the following operation starts. a ll 0s preceding the start bit are ignored. this applies to all command that will be discussed later. (2) for the meaning of am,dx,n,please see tables of command mode in page15. for example, am=a7,dx=d15,n=27. (1) when the read command is received, data is clocked out to do synchronously with the rising edge of sk. a 0 (dummy bit) is output first in sync with the address bit a0. then follows the 16-bit data from the selected address msb first. this ic has an address auto increment function that is available only for read command. after the first 16-bit data has been output to do and cs is kept high, a continuous sk clock input causes the address to increment automatically and the ic outputs a stream of successive data from consecutive addresses. 2. write cycle (write) for the meaning of am,dx,n, please se e tables of command mode in page15. (1) in this command, input 16bit data are written to designated addresses (am to a0). the actual write starts by the fall of cs of d0 taken sk clock. when status is not detected (cs=low fixed),make sure max 5ms time is in comforming with t e/w . when status is detected (cs=high), all commands are not accepted for areas where low (busy) is output from d0, therefore, do not input any command. 3. write all cycle (wral) for the meaning of dx,n,please see tables of command mode in page15. (1) in this command, input 16bit data is written simultaneously to all adresses. data is not written continuously per one word but is written in bulk, the write time is only max 5ms in conformity with t e/w . in wral, status can be detected in the same manner as in write command. cs 1 2 1 4 high-z 0 a m a 1 a 0 dx dx-1 d1 d0 sk di do 1 n status t cs t sv busy t e/w ready cs 1 2 1 5 high-z 0 0 0 dx dx-1 d1 d0 sk di do n status t cs t sv busy t e/w ready 1 fi gure 35. read cycle figure 36. write cycle figure 37. write all cycle am: msb of address dx: msb of data n: required clocks am: msb of address dx: msb of data n: required clocks dx: msb of data n: required clocks cs 1 2 1 4 high-z 1 am a1 a0 0 dx dx-1 d1 dx dx-1 *1 *2 d0 sk di do 0 n n+1 *2 (2) (1) (2) downloaded from: http:/// 17/36 datasheet datasheet br93g56-3b www.rohm.com tsz02201-09190g100030-1-2 27.feb.2013 rev.002 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 4. write enable (wen) / disable (wds) cycle for the meaning of n,please see tables of command mode in page15. (1) at power on, this ic is in write disable status by the internal reset circuit. before executing the write command, it is necessary to execute the write enable command. and, once this command is executed, it is valid unitl the write disable command is executed or the power is turned off. however, the read command is valid irrespective of write enable / diable command . input to sk after 6 clocks of this command is available by either 1 or 0, but be sure to input it. (2) when the write enable command is executed after power on, write enable status gets in. when the write disable command is executed then, the ic gets in write disable status as same as at power on, and then the write command is canceled thereafter in software manner. however, the read command is executable. in write enable status, even when the write command is input by fault, write is started. to prevent such error, it is recommended to execute the write disable command after completion of write. 5. erase cycle (erase) for the meaning of am,n,please see tables of command mode in page15. (1) in this command, data of the designated address is made into 1. the data of the designated address becomes ffffh. actual erase starts at the fall of cs after the fall of a0 taken sk clock. in erase, status can be detected in the same manner as in write command. 6. erase all cycle (eral) for the meaning of n,please see tables of command mode in page15. (1) in this command, data of all addresses is made into 1. data of all addresses becomes ffffh. actual erase starts at the fall of cs after the falll of the n-th clock from the start bit input. in eral, status can be detected in the same manner as in wral command. figure 38. write enable (wen) / disable (wds) c cs 1 2 1 1 1 4 high-z sk di do st atus t cs t sv busy t e/w ready a m a 3 a 2 a 1 n a 0 f igure 39. erase cycle cs 1 2 1 4 high-z sk di do st atus t cs t sv busy t e/w ready 1 n 0 0 0 f igure 40. erase all cycle cs 1 2 1 5 high-z 0 0 sk di do n 3 4 6 7 8 enable=1 1 disable=0 0 n: requir ed clocks am: msb of address n: required clocks n: required clocks downloaded from: http:/// 18/36 datasheet datasheet br93g56-3b www.rohm.com tsz02201-09190g100030-1-2 27.feb.2013 rev.002 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 application 1. method to cancel each command (1) read (2) write,wral (3) erase, eral (1) for the meaning of m,x, please see tables of command mode in page15 figure 41. read cancel available timing note 1) if vcc is turned off in this area, designated address data is not guaranteed, therefore, it is recommended to execute write once again. note 2) if cs is started at the same timing as that of the sk rise, write execution/cancel becomes uncertain. therefore, it is recommended to set cs to l in sk=low area. as for sk rise, recommended timing is t css /t csh or higher. figure 42. write, wral cancel available timing start bit pe code address ata 1bit 2bit m+1bit x+1bit cancel is available in all areas in read mode. ? method to cancel cancel by cs=low (1) a from start bit to the clock rise of d0 taken cancel by cs=low b when taken after the clock rise of d0. cancellation will be no longer possible. c n+1 clock rise and after cancel by cs=low however, when write is started in b area (cs is ended), cancellation is not available by any means. and when sk clock is output continuously cancel function is not available. start bit pe code address ata t w a (1) 1bit 2bit m+1bit x+1bit c b (1) for the meaning of m,n,x, please see tables of command mode in page15 (1) figure 43. erase, eral cancel available timing a from start bit to clock rise of a0 taken cancel by cs=low b clock rise of a0 taken cancellation is not available by any means. c n+1 clock rise and after cancel by cs=low however, when write is started in b area (cs is ended), cancellation is not available by any means. and when sk clock is output continuously cancel function is not available. note 1) if vcc is made off in this area, designated address data is not guaranteed, therefore write once again is suggested. note 2) if cs is started at the same timing as that of the sk rise, write execution/cancel becomes unstable, therefore, it is recommended to fall in sk=low area. as for sk rise, recommended timing of t css /t csh or higher. (1) for the meaning of m,n,please se e tables of command mode in page15 clock rise of a0 taken sk di n-1 a1 n n+1 n+2 b c a enlarged figure a0 clock rise of d0 taken sk di n-1 d1 d0 n n+1 n+2 b enlarged figure c a a1 1bit 2bit m+1bit a c b start bit pe code address t w (1) downloaded from: http:/// 19/36 datasheet datasheet br93g56-3b www.rohm.com tsz02201-09190g100030-1-2 27.feb.2013 rev.002 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 2. at standby when cs is low, even if sk, di, do are low, high or with middle electric potential, current does not exceed i sb1 max 3. i/o peripheral circuit (1) pull down cs. by making cs=low at power on/off, mistake in operation and mistake write are prevented. (a) pull down resistance r cs of cs pin to prevent mistake in operation and write error at power on/off, cs pull down resistor is necessary. select an appropriate resistor value from microcontroller v oh , i oh , and v il characteristics of this ic. (2) do is available in both pull up and pull down. do output always is high-z except in ready / busy status and data output in read command. when malfunction occurs at high-z input of the microcontroller port connected to do, it is necessary to pull down and pull up do. when there is no influence upon the microcontroller operations, do may be left open. if do is open during transition of output from busy to ready status, and at an instance where cs=high, sk=high, di=high, eeprom recognizes this as a start bit, resets ready output, and sets do=high-z. therefore, ready signal cannot be detected. to avoid such output, pull up do pin for improvement. figure 45. ready output timing at do=open microcontroller v ohm high output i ohm rcs v ihe low input eeprom figure 44. cs pull down resistance v ohm i ohm rcs ??? 2.4 2 10 -3 rcs 1.2 [k ] v ohm v ihe ??? rcs example) when vcc =5v, v ihe =2v, v ohm =2.4v, i ohm =2ma, from the equation , ? v ihe ? v ohm ? i ohm with the value of rpd to satisfy the above equation, v ohm becomes 2.4v or higher, and v ihe (=2.0v), the equation is also satisfied. : eeprom vih specifications : microcontroller v oh specifications : microcontroller i oh specifications cs sk di do d0 busy ready high-z enlarged cs sk di do busy high-z improvement by do pull up busy ready cs=sk=di=high when do=open cs=sk=di=high when do=pull up do high downloaded from: http:/// 20/36 datasheet datasheet br93g56- 3b www .rohm.com tsz0220 1-09190g100030-1-2 27.feb.2013 rev.002 ? 2013 r ohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 (a) pull up resistance r pu an d pull down resistance r pd of do pin as for pull up and pull down resistance value, select an appropriate resistor value from microcontroller v ih , v il , and v oh , i oh , v ol , i ol characteristics of this ic. (b) ready / busy status display (do terminal) this display outputs the internal status signal. when cs is started after t cs f rom cs fall after write command input, high or low is output. r/b displa y low (busy) = write under execution after the timer circuit in the ic works and creates the period of t e/w , this timer circuit completes automatically . and the memory cell is written in the period of t e/ w , and during this period, other command is not accepted. r/b display = high (ready) = command wait status after t e/ w (max5ms) the follo wing command is accepted. therefore, cs=high in the period of t e/w , and if signals are input in sk, di, malfunction ma y occur, therefore, di=low in the area cs=high. (especially, in the case of s hared input port, attention is required.) *do no t input any command while status signal is active. command i nput in busy area is cancelled, but command input in ready ar ea is accepted. therefore, status ready output is cancelle d, and malfunction and mistake write may occur. microcontroller v ilm lo w input i ole v ole low output eeprom rp u mic rocontroller v ihm hi gh input i ohe v ohe h igh output eeprom rp d fig ure 46. do pull up resistance rpu ??? 5 0. 4 2.1 10 -3 r pu 2. 2 [k ] v ole v ilm ??? rpu exam ple) when vcc =5v , v ole =0 .4v, i ole =2 .1ma, v ilm =0 .8v, from the equation , vcc v ole i ole w ith the value of rpu to satisfy the above equation, v ole becomes 0.4v or below, and with v ilm (= 0.8v), the equation is also satisfied. rpd ??? 5 0. 2 0.1 10 -3 r pd 48 [k ] v ohe v ihm ??? rpd exam ple) when vcc =5v , v ohe =vcc 0. 2v, i ohe =0 .1ma, v ihm =vcc 0. 7v from the equation , v ohe i ohe w ith the value of rpd to satisfy the above equation, v ohe becomes 2.4v or below, and with v ihm (= 3.5v), the equation is also satisfied. figure 47. do pull down resistance do st atus do status f igure 48. ready/busy status output timing chart : eeprom v ol specif ications : eeprom i ol specif ications : microcontroller v il specif ications ? v ole ? i ole ? v ilm : eeprom v oh specif ications : eeprom i oh specif ications : microcontroller v ih specif ications ? v ohe ? i ohe ? v ihm cs high -z sk di do cl ock wr ite instruction r eady stat us t sv bu sy t e/ w downloaded from: http:/// 21/36 datasheet datasheet br93g56-3b www.rohm.com tsz02201-09190g100030-1-2 27.feb.2013 rev.002 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 4. when to directly connect di and do this ic has independent input terminal di and output terminal do, wherein signals are handled separately on timing chart. but, by inserting a resistance r between these di and do terminals, it is possible to carry out control by a single con trol line. (a) data collision of microcontroller di/o output and do output and feedback of do output to di input of eeprom. drive from the microcontroller di/o output to di input of eeprom on i/o timing, and output signal from do output of eeprom occur at the same time in the following points. (1) 1 clock cycle to take in a0 address data at read command dummy bit 0 is output to do terminal. when address data a0 = 1 input, through current route occurs. (2) timing of cs = high after write command. do terminal in ready / busy function output . when the next start bit input is recognized, high-z gets in. especially, at command input after write, when cs input is started with microcontroller di/o output low, ready output high is output from do terminal, and through current route occurs. feedback input at timing of these (1) and (2) does not cause disorder in basic operations, if resistance r is inserted. note) as for the case (2), attentio n must be paid to the following. when status ready is active, do and di are shared, di=high an d the microcontroller di/o=high-z or the microcontroller di/o=high ,if sk clock is input, do output is input to di and is recognized as a start bit, and malfunction may occur. as a method to avoid malfunctio n, at status ready output, set sk=low, or start cs within 4 cl ocks after high of ready signal is output. figure 49. di, do control line common connection eeprom cs input eeprom sk input eeprom di input eeprom do output microcontroller di/o port a1 high-z collision of di input and do output high a0 0 dx dx-1 dx-2 a1 a0 high-z microcontroller output microcontroller input figure 50. collision timing at read data output at di, do direct connection eeprom cs input eeprom sk input eeprom di input eeprom do output microcontroller di/o port write command microcontroller output busy busy ready ready ready collision of di input and do output hig h-z write command write command write command write command microcontroller input microcontroller output figure 51. collision timing at di, do direct connection cs sk di do ready high-z start bit because di=high, se t sk=low at cs rise. figure.52 start bit input timing at di, do direct connection (1) (1) x=15,for the meaning of x , please see tables of command mode in page15. microcontroller di/o port di eeprom do r downloaded from: http:/// 22/36 datasheet datasheet br93g56-3b www.rohm.com tsz02201-09190g100030-1-2 27.feb.2013 rev.002 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 (a) selection of resistance value r the resistance r becomes a short-circuit current limiting resistance during signal conflicts and it does not affect the basic operations of the device. when short-circuit current flows, glitches in the power source lines may be produced. determine the maximum transient current in the power lines wherein glitches are not produced. select the value of resistance r that will satisfy the eeprom input level v ih /v il , even under the influence of voltage fluctuations resulting from short-circuit current and so forth. assuming the allowable short-circuit current defined as i, the following relation should be satisfied. (3) address data a0 = 1 input, dummy bit 0 output timing (when microcontroller di/o output is high, eeprom do outputs low, and high is input to di) (a) make the through current to eeprom 10ma or below. (b) see to it that the level v ih of eeprom should satisfy the following. (4) do status ready output timing (when the microcontroller di/o is low, eeprom do output high, and low is input to di) (a) set the eeprom input level v il so as to satisfy the following. microcontroller di/o port di eeprom do r high output i ohm v ohm v ole low outpu figure 53. circuit at di, do direct connection (microcontroller d i/o high output, eeprom low output) conditions v ihe i ohm r + v ole at this moment, if v ole =0v, v ihe i ohm r r ??? v ihe i ohm microcontroller di/o port di eeprom do r low output i olm v olm v ohe high output conditions v ile v ohe C i olm r as this moment, v ohe =v cc v ile vcc C i olm r r ??? vcc C v ile i olm figure 54. circuit at di, do direct connection (microcontroller d i/o low output, eeprom high output) example) when v cc =5v, v ohm =5v, i ohm =0.4ma, v olm =5v, i olm =0.4ma, from the equation , from the equation , r r v ihe i ohm 3.5 0.4 10 -3 r 8.75 [k ? ] ??? r r vcc C v ile i olm 5 C 1.5 2.1 10 -3 r 1.67 [k ? ] ??? therefore, from the equations and , r 8.75 [k ? ] : eeprom v ih specifications : eeprom v ol specifications : microcontroller i oh specifications ? v ihe ? v ole ? i ohm : eeprom v il specifications : eeprom v oh specifications : microcontroller i ol specifications ? v ile ? v ohe ? i olm downloaded from: http:/// 23/36 datasheet datasheet br93g56-3b www.rohm.com tsz02201-09190g100030-1-2 27.feb.2013 rev.002 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 5. i/o equivalence circuit 6. power-up/down conditions (1) at power on/off, set cs low. when cs is high, this ic gets in input accept status (active). at power on, set cs low to prevent malfunction and write error from noise (when cs is in low status, all inputs are cancelled.). at power decline, low power status may prevail. therefore, at power off, set cs low to prevent malfunction from noise. (2) por circuit this ic has a por (power on reset) circuit as a mist ake write countermeasure. after por operation, it gets in write disable status. the por circuit is valid only when power is on, and does not work when power is off. however, if cs is high at power on/off, it may become write enable status owing to noises and the likes. for secure operations, observe the follwing conditions. (a) set cs=low (b) turn on power so as to satisfy the recommended conditions of t r , t off , vbot for por circuit operation. (3) lvcc circuit lvcc (v cc -lockout) circuit prevents data rewrite operation at low power, and prevents wrong write. at lvcc voltage (typ=1.2v) or below, it prevent data rewrite output circuit do oeint. figure 55. output circuit (do) figure 57. input circuit (di) figure 56. input circuit (cs) figure 58. input circuit (sk) vcc gnd vcc gnd vcc cs bad example good example figure 59. timing at power on/off figure 60. rise waveform diagram bad example cs pin is pulled up to vcc when ic is turned on while cs is high, eeprom malfunction write error may occur due to noise and the likes. its also possible to happen even when cs input is high-z. good example it is low at power on/off. set 10ms or higher to recharge at power off. when power is turned on wit hout observing this condition, ic internal circuit may not be reset, so please note. recommended conditions of t r , t off , vbot t off t r vbot 0 vcc t r t off vbot 10ms or below 10ms or higher 0.3v or below 100ms or below 10ms or higher 0.2v or below input circuit cs csint. reset int. input circuit di cs int. input circuit sk cs int. downloaded from: http:/// 24/36 datasheet datasheet br93g56-3b www.rohm.com tsz02201-09190g100030-1-2 27.feb.2013 rev.002 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 7. noise countermeasures (1) vcc noise (bypass capacitor) when noise or surge gets in the power source line, malfunction may occur, therefore, for removing these, it is recommended to connect a by pass capacitor (0.1 f) between ic vcc and gnd, at that moment, connect the capacitor as close to ic as possible.and, it is also recommended to connect a bypass capacitor between boards vcc and gnd. (2) sk noise when the rise time of sk is long, and a certain degree or more of noise exists, malfunction may occur owing to clock bit displacement. to avoid this, a schmitt trigger circui t is built in sk input. the hysteresis width of this circuit is set about 0.2v, if noises exist at sk input, set the noise amplitude 0.2vp-p or below. and it is recommended to set the rise time of sk 100ns or below. in the case when the rise time is 100ns or higher, take sufficient noise countermeasures. make the clock rise, fall time as small as possible. downloaded from: http:/// 25/36 datasheet datasheet br93g56-3b www.rohm.com tsz02201-09190g100030-1-2 27.feb.2013 rev.002 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 operational notes 1. described numeric values and data are design represent ative values only, and the values are not guaranteed. 2. we believe that application circuit examples are recommendable. however, in actual use, confirm characteristics further sufficiently. in the case of use by changing the fixed number of external parts, make your decision with sufficient margin in consideration of static characteristics and transition characteristics and fluctuations of external parts and our ic. 3. absolute maximum ratings if the absolute maximum ratings such as supply voltage and operating temperature and so forth are exceeded, lsi may be destructed. do not supply voltage and temperature exceeding the absolute maximum ratings. in the case of fear exceeding the absolute maximum ratings, take physical safety countermeasures such as fuses, and see to it that conditions exceeding the absolute maximum ratings should not be supplied to lsi. 4. gnd electric potential set the voltage of gnd terminal lowest at any operating condition. make sure that each terminal voltage is not lower than that of gnd terminal at any time, even during transient condition. 5. thermal design use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (pd) in actual operating conditions. 6. short between pins and mounting errors be careful when mounting the ic on printed circuit boards. the ic may be damaged if it is mounted in a wrong orientation or if pins are shorted together. short circuit ma y be caused by conductive particles caught between the pins. 7. operating the ic in the presence of strong electroma gnetic field may cause malfunction, therefore, evaluate design sufficiently. downloaded from: http:/// 26/36 datasheet datasheet br93g56-3b www.rohm.com tsz02201-09190g100030-1-2 27.feb.2013 rev.002 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 part numbering b r 9 3 g 5 6 x x x 3 x x x bus type 93 microwire operating temperature / operating voltage -40 to +85 / 1.7v to 5.5v process code pin a ssignment blank: pin1 to 8: cs, sk, di, do, gnd, org, du, vcc respectively a : pin1 to 8: cs, sk, di, do, gnd, nc, du, vcc respectively b : pin1 to 8: du, vcc, cs, sk, di, do, gnd, nc respectively 56=2k capacity package blank :dip-t8 f :sop8 fj :sop-j8 fv :ssop-b8 fvt :tssop-b8 fvj :tssop-b8j fvm :msop8 nux :vson008x2030 packaging and forming specification e2 : embossed tape and reel (sop8,sop-j8, ssop-b8,tssop-b8, tssop-b8j) tr : embossed tape and reel (msop8, vson008x2030) blank : tube (dip-t8) downloaded from: http:/// 27/36 datasheet datasheet br93g56-3b www.rohm.com tsz02201-09190g100030-1-2 27.feb.2013 rev.002 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 physical dimensions tape and reel information ? order quantity needs to be multiple of the minimum quantity. 28/36 datasheet datasheet br93g56-3b www.rohm.com tsz02201-09190g100030-1-2 27.feb.2013 rev.002 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 ? order quantity needs to be multiple of the minimum quantity. 29/36 datasheet datasheet br93g56-3b www.rohm.com tsz02201-09190g100030-1-2 27.feb.2013 rev.002 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 ? order quantity needs to be multiple of the minimum quantity. 30/36 datasheet datasheet br93g56-3b www.rohm.com tsz02201-09190g100030-1-2 27.feb.2013 rev.002 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 ? order quantity needs to be multiple of the minimum quantity. 31/36 datasheet datasheet br93g56-3b www.rohm.com tsz02201-09190g100030-1-2 27.feb.2013 rev.002 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 direction of feed reel ? order quantity needs to be multiple of the minimum quantity. 32/36 datasheet datasheet br93g56-3b www.rohm.com tsz02201-09190g100030-1-2 27.feb.2013 rev.002 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 direction of feed reel ? order quantity needs to be multiple of the minimum quantity. 33/36 datasheet datasheet br93g56-3b www.rohm.com tsz02201-09190g100030-1-2 27.feb.2013 rev.002 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 direction of feed reel ? order quantity needs to be multiple of the minimum quantity. 34/36 datasheet datasheet br93g56-3b www.rohm.com tsz02201-09190g100030-1-2 27.feb.2013 rev.002 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 ? order quantity needs to be multiple of the minimum quantity. 35/36 datasheet datasheet br93g56-3b www.rohm.com tsz02201-09190g100030-1-2 27.feb.2013 rev.002 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 marking diagrams dip-t8 (top view) br93g56b part number marking lot number sop8(top view) part number marking lot number 1pin mark sop-j8(top view) part number marking lot number 1pin mark tssop-b8(top view) part number marking lot number 1pin mark tssop-b8j(top view) part number marking lot numbe r 1pin mark ssop-b8(top view) part number marking lot number 1pin mark vson008x2030 (top view) part number marking lot number 1pin mark msop8(top view) part number marking lot number 1pin mark 9g56b 9g56b 9 g b b 9 g 5 6 b 9g5 9gb 9g5 6b3 6b3 b g 3 downloaded from: http:/// 36/36 datasheet datasheet br93g56-3b www.rohm.com tsz02201-09190g100030-1-2 27.feb.2013 rev.002 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 revision history date revision changes 23.aug. 2012 001 new release 27.feb.2013 002 update some english words, sentences descriptions, grammar and formatting. delete status of this document in page 25. delete lineup after part numbering in page26. downloaded from: http:/// datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class | class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:/// datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:/// datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:/// |
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